Samsung Electronics Co Ltd have announced the industry’s first multi chip package or MCP with PRAM for use later this quarter in mobile handsets.

The Samsung PRAM 512 megabit which is in the MCP is backward compatible with 40 nanometer class, nor flash memory in either the hardware or the software functions. This allows those handset designers out there the ability to have multi chip packaging which is fully compatible with both past and also standalone PRAM chip technology.

It is expected that PRAM will be embraced nicely next year as the successor to NOR flash in the consumer electronics designs, and subsequently becoming a major in memory technology.

Dong-soo Jun executive vice president of memory sales and marketing Samsung Electronics said that the launch of their PRAM in an advanced MCP solution for the replacement of the 40nm class and finer geometry NOR meets this need head on.

Source – tweaktown.com